高流动性碳化硅类球粉
图文详情
碳化硅类球粉是西安博尔通过自主研发的工艺技术生产出来的晶体完整、缺陷少、密度高、球形度好的产品。产品粒度分布窄、比表面积小、流动性好、洁净度高。满足高导热、高耐磨、高填充、高流动性和良好成型性等材料设计要求。适用于3D打印、陶瓷、喷涂、复合材料等领域。
BESC-T系列型号及指标参数
|
产品 型号 |
D10/μm |
D50/μm |
D90/μm |
D97/μm |
振实密度g/cm3 |
SiC% |
Fe2O3% |
SiO2% |
F.Si% |
F.C% |
|
BESC-T03 |
0.08 |
0.37 |
0.72 |
0.90 |
0.70 |
﹥98 |
﹤0.2 |
﹤0.5 |
﹤0.2 |
﹤0.1 |
|
BESC-T05 |
0.08 |
0.47 |
0.95 |
1.21 |
0.80 |
﹥98 |
﹤0.2 |
﹤0.5 |
﹤0.2 |
﹤0.1 |
|
BESC-T1 |
0.43 |
1.02 |
2.43 |
2.85 |
0.81 |
﹥98 |
﹤0.2 |
﹤0.5 |
﹤0.2 |
﹤0.1 |
|
BESC-T1.5 |
0.59 |
1.54 |
2.78 |
3.40 |
0.85 |
﹥98 |
﹤0.2 |
﹤0.3 |
﹤0.2 |
﹤0.05 |
|
BESC-T2.5 |
1.55 |
2.76 |
4.62 |
5.55 |
1.18 |
﹥98 |
﹤0.2 |
﹤0.3 |
﹤0.2 |
﹤0.05 |
|
BESC-T3.5 |
2.27 |
3.67 |
5.71 |
6.62 |
1.45 |
﹥98 |
﹤0.2 |
﹤0.3 |
﹤0.2 |
﹤0.05 |
|
BESC-T5 |
2.93 |
4.63 |
7.06 |
8.20 |
1.63 |
﹥98 |
﹤0.2 |
﹤0.2 |
﹤0.2 |
﹤0.05 |
|
BESC-T7 |
4.03 |
6.54 |
10.3 |
12.10 |
1.65 |
﹥98 |
﹤0.2 |
﹤0.2 |
﹤0.1 |
﹤0.05 |
|
BESC-T10 |
6.02 |
10.3 |
17.3 |
19.60 |
1.70 |
﹥99 |
﹤0.08 |
﹤0.1 |
﹤0.1 |
﹤0.05 |
|
BESC-T14 |
9.15 |
13.2 |
18.4 |
20.4 |
1.72 |
﹥99 |
﹤0.08 |
﹤0.1 |
﹤0.1 |
﹤0.05 |
|
BESC-T20 |
11.5 |
19.0 |
30.5 |
35.3 |
1.75 |
﹥99 |
﹤0.08 |
﹤0.1 |
﹤0.1 |
﹤0.05 |
|
BESC-T28 |
14.7 |
22.6 |
35.0 |
42.7 |
1.76 |
﹥99 |
﹤0.08 |
﹤0.1 |
﹤0.1 |
﹤0.05 |
|
BESC-T40 |
22.0 |
34.2 |
53.6 |
64.6 |
1.80 |
﹥99 |
﹤0.08 |
﹤0.1 |
﹤0.1 |
﹤0.05 |
|
BESC-T65 |
40.5 |
66.0 |
104 |
122 |
1.85 |
﹥99 |
﹤0.08 |
﹤0.1 |
﹤0.1 |
﹤0.05 |
|
BESC-T75 |
46.2 |
75.3 |
120 |
140 |
1.92 |
﹥99 |
﹤0.08 |
﹤0.1 |
﹤0.1 |
﹤0.05 |
|
BESC-T85 |
49.8 |
84.1 |
138 |
163 |
1.96 |
﹥99 |
﹤0.08 |
﹤0.1 |
﹤0.1 |
﹤0.05 |
|
BESC-T100 |
65.7 |
103 |
160 |
189 |
1.99 |
﹥99 |
﹤0.08 |
﹤0.1 |
﹤0.1 |
﹤0.05 |
|
BESC-T120 |
76.5 |
118 |
180 |
198 |
1.95 |
﹥99 |
﹤0.08 |
﹤0.1 |
﹤0.1 |
﹤0.05 |
部分产品粒径分布与电镜图
BESC-T1.5
BESC-T2.5
BESC-T5
BESC-T10
BESC-T65
BESC-T85
ONLINE MESSAGE
在线留言
*注：请务必信息填写准确，并保持通讯畅通，我们会尽快与你取得联系
联系我们
